TI enables greater system reliability in hybrid and electric vehicles with highly accurate monitoring and protection
05/10/2019 | 109Texas Instruments introduced fully tested reference designs for battery management and traction inverter systems, along with new analog circuits with advanced monitoring and protection features to help reduce carbon dioxide emissions and enable hybrid electric vehicles and electric vehicles (HEV/EVs) to drive farther and longer.
Industry's first integrated quad- and dual-channel RF-sampling transceivers enable multiantenna wideband systems
04/02/2019 | 60Texas Instruments introduced two new RF-sampling transceivers that are the first in the industry to integrate four analog-to-digital converters (ADCs) and four digital-to-analog converters (DACs) in a single chip. With the industry’s widest frequency range, highest instantaneous bandwidth and 75 percent smaller design footprint than a discrete solution, the quad-channel AFE7444 and dual-channel AFE7422 transceivers help engineers more easily achieve multiantenna, direct RF sampling for radar, software defined radio and wireless 5G applications.
03/19/2019 | 61Texas Instruments (TI) announced the industry’s first multiprotocol gigabit (Gb) time-sensitive networking (TSN)-enabled processor family. The new, highly integrated Sitara™ AM6x processor family provides industrial-grade reliability, with quad and dual Arm® Cortex®-A53 core variants built to meet the rapidly evolving needs of Industry 4.0 in factory automation, motor drives and grid infrastructure.
Smallest reinforced isolated CAN FD transceivers deliver the industry's highest bus fault protection
03/05/2019 | 127Texas Instruments (TI) introduced two new isolated Controller Area Network (CAN) flexible data rate (FD) transceivers that combine the industry’s highest bus fault protection, highest common-mode transient immunity (CMTI), and lowest electromagnetic emissions into a 35 percent smaller package.
02/01/2019 | 71Texas Instruments (TI) introduced four tiny precision data converters, each the industry’s smallest in its class. The new data converters enable designers to add more intelligence and functionality, while shrinking system board space. The DAC80508 and DAC70508 are eight-channel precision digital-to-analog converters (DACs) that provide true 16- and 14-bit resolution, respectively. The ADS122C04 and ADS122U04 are 24-bit precision analog-to-digital converters (ADCs) that feature a two-wire, I2C-compatible interface and a two-wire, UART-compatible interface, respectively.
01/15/2019 | 93To advance millimeter-wave (mmWave) sensor technology in worldwide industrial applications, Texas Instruments (TI) announced its 60-GHz sensor portfolio, the highest resolution single-chip, complementary metal-oxide semiconductor (CMOS), for industrial systems.
01/01/2019 | 111To advance millimeter-wave (mmWave) sensor technology in worldwide industrial applications, Texas Instruments announced its 60-GHz sensor portfolio, the highest resolution single-chip, complementary metal-oxide semiconductor (CMOS), for industrial systems.
Industry's first 200-W and 100-W USB Type-C™ and USB Power Delivery controllers with fully integrated power paths simplify designs
10/30/2018 | 119Texas Instruments (TI) introduced two new USB Type-C™ and USB Power Delivery (PD) controllers, with fully integrated power paths to simplify designs, minimize solution size and speed time to market. The TPS65987D and TPS65988 offer system designers the industry's highest level of integration which can reduce design complexity and overall cost.
TI DLP® technology brings micron-to-sub-millimeter industrial accuracy, speed and flexibility to desktop 3D printers and portable 3D scanners
09/11/2018 | 154Texas Instruments (TI) announced new DLP® Pico™ controllers that deliver advanced light control capabilities in smaller form factors for mass-market 3D scanners and 3D printers. DLPC347x controllers offer the micron-to-sub-millimeter resolution typically found in high-performance, industrial-grade applications in a smaller form factor for desktop 3D printers and portable 3D scanners.
Integration at its core: New MSP430™ MCUs offer configurable signal-chain elements for sensing applications
08/24/2018 | 266Texas Instruments announced the addition of new microcontrollers (MCUs) with integrated signal-chain elements and an extended operating temperature range to its MSP430™ value line portfolio. New MSP430FR2355 ferroelectric random access memory (FRAM) MCUs allow developers to reduce printed circuit board (PCB) size and bill-of-materials (BOM) cost while meeting temperature requirements for sensing and measurement in applications such as smoke detectors, sensor transmitters and circuit breakers.
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