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DesignCon 2021

DesignCon 2021

12/30/2020

Created by engineers for engineers, DesignCon brings together 5,000 professionals from the high-speed communications and semiconductor communities for three jam-packed days of education and activities. Through an in-depth conference program curated by a 90-person Technical Program Committee and expo showcase, this event offers state-of-the-art design methodologies, applications, technologies, and unparalleled networking opportunities.

Conference
Access more than 100 sessions across 14 tracks covering:

  • Signal and power integrity
  • Chip I/O and power modeling
  • Photonics and wireless in electrical design
  • Materials and processing for PCBs, modules, and packages
  • Advanced I/O interface design
  • High-speed link design
  • Signal processing, equalization, and coding/FEC
  • Power integrity in power distribution networks
  • Electromagnetic compatibility and interference
  • Test and measurement methodology
  • Interconnects modeling and analysis
  • Machine learning and AI
  • 5G and communications

Conference dates:
Tuesday, August 16, 2021: 8 a.m.6 p.m.
Wednesday, August 17, 2021: 8 a.m.5.30 p.m.
Thursday, August 18, 2021: 8 a.m.5.30 p.m.

Conference overview

Exhibition
With leading suppliers on the expo floor, the latest in high-speed design tools, technologies, and developments will be on display at the DesignCon expo. DesignCon remains the place for chip, board, and systems design engineers to source, network, and stay ahead of industry change. In one lap of the floor, discover breakthrough solutions, free activities, networking events, educational sessions, and more.

Expo dates:
Wednesday, August 17, 2021: 11 a.m.6 p.m.
Thursday, August 18, 2021: 11 a.m.6 p.m.

Expo overview

More details are available on DesignCon web site.


Start date:  08/16/2021
End date:  08/18/2021
Venue:  San Jose, CA, USA; San Jose McEnery Convention Center
Organizer:  Informa Markets, a trading division of Informa PLC

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Current issue
#2 June 2021
KIPiS 2021 #2
Topic of the issue:
Modern instrumentation
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