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Best-in-Test 2014 finalists: Manufacturing Test![]() 01/19/2014 Very soon we will get to know who has managed to win Best-in-Test Award annually held to announce innovative developments worthy to become the best in test and measuring world. Winners will be rewarded on January 29 in Santa Clara Convention Center, Santa Clara, CA, USA. Here are the winners in category Manufacturing Test. M9703A AXIe Eight-Channel Wideband Digital Receiver/Digitizer, Agilent Technologies
The M9703A-FRF delivers dynamic range and sensitivity over the full input frequency range for improved analog performance, with optimized analog-to-digital conversion, offering improvements of 0.3 effective bits, 2dB signal-to-noise ratio, and 4dB spurious-free dynamic range. It also provides real-time digital downconversion (DDC) on the data for up to 80MHz analysis bandwidth (160 MHz in I+jQ mode) with center frequencies from DC to 2 GHz. The wide input frequency range, combined with a very low noise power spectral density (down to -145dBm/Hz, comparable to a 16-bit digitizer), make the M9703A a step toward a fully digital receiver. In addition, the M9703A-LDC provides an accelerated connection to the software measurement layer, such as Agilent's 89600 Vector Signal Analysis software. M9703A-M16 provides 16GB of onboard memory, corresponding to 1Gsample per channel, for applications requiring a long acquisition time. RF Device PXI Test Solution, Agilent Technologies
ScanWorks Intel SiliconView Technology, ASSET InterTech
Based on ASSET’s nine-year collaboration with Intel, ScanWorks supports Intel SVT in both processors and chipsets. Intel SVT is a key Intel strategy to support embedded instruments. Intel SVT is an on-chip DFx (design for debug, test or validation) set of capabilities that addresses the challenges designers and manufacturers must overcome when faced with shorter development cycles, shrinking form-factors, and greater performance expectations in tighter power envelopes. Specifically, ScanWorks HSIO tools work with the Intel SVT electrical validation capabilities to measure and optimize operational timing and voltage margins on high-speed data links and buses such as PCI Express Graphics, Direct Media Interface (DMI) and the DDR3/4 memory bus. ScanWorks functions interactively with Intel SVT to investigate the root causes of low operating margins on these buses. In a board manufacturing test setting, ScanWorks Boundary-Scan Test (BST) and Processor-Controlled Test (PCT) function with Intel SVT to test and diagnose both structural and at-speed defects. Intel SVT and ScanWorks enabe at-speed tests for high-speed interfaces, thereby reducing dependencies on board functional test and lowering test cost. The ScanWorks Arium hardware-assisted debuggers quickly isolate the root causes of firmware and software code bugs on Intel processors and chipsets. compactUTS Functional Test Platform, Bloomy Controls
A robust interconnect allows quick connection of DUTs through DUT-specific cables. A switch matrix routes the various analog, digital, and power signals to the instruments under the control of a PC running National Instruments' software. Small and simple for operators to employ on the manufacturing line, the compactUTS is also easy to program by test engineers using the included compactUTS NI LabVIEW drivers and optional UTS Software Suite for NI TestStand. Versatile instruments power the compactUTS through USB interface, including an NI USB-4065 DMM, NI USB-6341 data-acquisition system, and a Bloomy Controls switch matrix and power control module. These instruments connect through a high-density Virginia Panel Corporation i1 jack on the desktop enclosure. Each DUT-specific cable is electronically keyed to assure the proper test procedure executes for the attached device. LabVIEW developers can use the included compactUTS drivers. TestStand developers can reduce test sequence creation effort by using an optional UTS Software Suite. SFX-TAP16/G-RM TAP Transceiver, Goepel Electronic
The SFX-TAP16/G-RM, available as rack mount version in 19-in. technology (1U), provides 16 parallel TAPs. Its architecture supports all modern ESA (Embedded System Access) technologies, including boundary scan, processor emulation, and chip-embedded instrumentation, providing test and programming methods without mechanical probe access. The new transceiver can be adapted to the UUT characteristics; its bandwidth reaches from concurrent test/programming of 16 UUTs with a single TAP to two UUT with eight TAP each. In addition, the TAPs can be individually programmed in many parameters. Interest is growing for high-speed programming of Flash through processor debug interfaces or with an FPGA-embedded programmer. This new addition ensures the utilization of dynamic tests based on processor emulation in production lines or stress tests in climatic chambers. The detection of latent defects in particular in HASS/HALT procedures becomes more and more important for many test and production scenarios. J750Ex-HD Production Test System, Teradyne
The HSD800 Multifunction Instrument delivers 128 digital channels plus test resources for MCU testing. Its integrated DIB Access Matrix enables connection between a single Device-Under-Test pin to a digital channel or other HSD800 resources (e.g., 18V/100mA resource for a broad range of embedded memory testing)or even external instruments without loadboard switching circuitry. The HSD800 also supports concurrent testing so that multiple memory or logic blocks can be tested concurrently. The high growth of sensors in consumer electronics will drive more ADCs per MCU and higher performance. The new 72-channel HD CTO is a precision DC and analog instrument capable of testing 14-bit SAR ADCs, 24-bit Sigma Delta ADCs and 12-bit DACs. The system includes source and capture plus integrated voltage references within a single instrument. EDN Network, www.edn.com |
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