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Best-in-Test 2014 finalists: Machine Vision/Inspection
Very soon we will get to know who has managed to win Best-in-Test Award annually held to announce innovative developments worthy to become the best in test and measuring world. Winners will be rewarded on January 29 in Santa Clara Convention Center, Santa Clara, CA, USA.
Here are the winners in category Machine Vision/Inspection.
OptiCon THT-Line Automated Inspection Systems, Goepel Electronic
The OptiCon THT-Line lets two independently working AOI modules be integrated in one system. On the one hand, this applies for THT component inspection executed typically in the upper accumulating transport within the wave solder process. On the other hand, an independently working second AOI module for THT solder joints and wave-soldered SMD components can be applied either in the lower accumulating return transport or in the upper transport system.
These combinational variants provide numerous opportunities to adapt the overall system with integrated AOI modules to company-specific production processes. The system's installation before the wave solder oven is particularly effective, as THT components are inspected before soldering and the PCB bottom side is optically inspected in the lower accumulating return transport within the same system enclosure.
A new AOI module for assembly and bottom-side inspection provides this flexibility. The entire module height incl. camera, lens, illumination unit and x/y positioning system is only about 200mm, which is unrivalled among AOI systems with matrix cameras. The AOI modules also feature the entire and well-proven illumination variety of the OptiCon AOI system family.
THT component and solder joint side inspection can be executed at several positions in a production line, either at the upper conveyer belt or during the PCB return in the lower system area.
MV-9 2D/3D CoaXPress In-Line AOI Series, MIRTEC
MIRTEC's MV-9 2D/3D CoaXPress In-Line AOI systems are configured with MIRTEC’s OMNI-VISION 3D Inspection Technology, which combines 25Megapixel 2D Inspection with advanced Digital Multi-Frequency Moiré 3D inspection. That provides precision inspection of SMT devices on finished PCB assemblies. MV-9 systems may be configured with a state-of-the-art CoaXPress 25 Mega Pixel top-down camera system.
MIRTEC’s CoaXPress Camera Technology can provide data transfer rates of 25Gbits/s, making the MV-9 the world's fastest 2D/3D AOI system. A six-phase lighting system uses multicolor LEDs to illuminate inspection areas from six different angles providing superior solder joint characterization and co-planarity inspection of leads on gull-wing devices. MIRTEC’s Digital Multi Frequency Quad Moiré Technology provides true 3D inspection of SMT devices on finished PCB assemblies using a total of four Moiré Inspection Probes, which yields precise height measurement used to detect lifted-component and lifted-lead defects as well as solder volume post reflow.
Fully configured, the MIRTEC MV-9 machines also feature four 10 MPixel Side-View Cameras in addition to the 25MPixel Top-Down CoaXPress Camera. There is little doubt that this new technology will, undoubtedly, set the standard by which all other inspection equipment will be measured.
V810 XXL AXI, 3D In-Line Advanced X-Ray Inspection System, ViTrox
ViTrox's V810 XXL In-line 3D Advanced X-Ray Inspection system (AXI) provides the fastest inspection speed and widest test coverage. It can inspect board sizes up to 26in. x 38in with board thickness up to 500mils of accuracy and board weight up to 15kgs.
V810 XXL’s state-of-art technology is based on Digital Tomosynthesis methodology. The advanced Digital Reconstruction Technology reconstructs X-ray images from multiple angled cameras and effectively separates the top and bottom-side of the board images clearly. Hybrid Auto Focus technology lets the system intelligently focus on desired z- height without any mechanical movement from X-ray or stage, which reduces measurement uncertainty.
V810 XXL's Global Surface Modeling (GSM) feature let it use the neighboring joints and advanced mathematical modeling to effectively compensate for board warpage and improve call rate. Multi-Camera User Gain yields brighter, cleaner and sharper images without any artifacts, especially on highly shaded components such as PTHs, Ventura connectors, BGAs, chip under BGAs, and board with thickness of 280 mils.
A feature called the Floodfill method uses two algorithms to accurately locate a void defect. These algorithms "flood" the obvious holes in pads for void measurement, letting the V810 XXL detect and measure voids with GR&R of 7%. Variable Magnification (VM) enables the V810 XXL to inspect small-pitch component joints, such as 01005s and micro BGAs with joints less than 200 microns at 10-micron resolution.www.edn.com
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